Home/ PCB
CircuitEDGE A premier brand by Synvert

PCB/PCBA Design,
Fabrication& Component Supply

High-performance printed circuit boards tailored for defense, biomedical, aerospace, and mission-critical applications — multilayer designs up to 60 layers, including HDI, rigid-flex, aluminum, thick copper, and ceramic PCB fabrication.

— Max layers
Up to 60
— PCB types
Rigid · Flex · HDI
— Standards
IPC Class 3
— Assembly
SMT & PTH
— Unmatched capabilities

Built for critical
sectors.

Advanced PCB technology engineered for precision, reliability, and the most demanding operating environments.

— PCB types

Layer & construction

Single-layer, double-layer, multilayer (up to 40 layers in catalogue; up to 60 layers in advanced builds), rigid-flex, and HDI designs.

— Materials

High-performance substrates

FR4, Rogers, and Polyimide for high-temperature, high-frequency, and extreme durability requirements.

— Finishes

Precision surface treatment

ENIG, HASL, OSP, immersion silver/tin, ENEPIG, flash gold, and hard gold plating — tailored to mission-specific needs.

— Advanced technology

Specialized PCB builds.

HDI PCB Rigid PCB Rigid-Flex PCB Aluminum PCB Thick Copper PCB Ceramic PCB Embedded System Firmware Component Supply
— Reliability & compliance

Verified before
deployment.

Global standards

Adherence to ISO 9001, ROHS, and military-grade specifications across design, fabrication, and assembly workflows.

Comprehensive testing

AOI, X-ray inspection, and rigorous functional testing to ensure operational excellence on every build.

— Sectors served

Where CircuitEDGE
deploys.

R&D Military Radar UAV Telecommunication Defense Aerospace
— PCB technical capabilities

Core manufacturing
specifications.

Select a board type to view key manufacturing limits. Full datasheet pages are available below.

ParameterRigid capability
Max layer count60 layers
Inner layer min trace/space3/3 mil
Outer layer min trace/space3/3 mil
Inner / outer layer max copper6 oz / 6 oz
Min mechanical / laser drilling0.15 mm / 0.1 mm
Aspect ratio (mechanical drilling)20:1
Board thickness0.4 – 8 mm
Min / max board size10×10 mm / 22.5×30 in
Min BGA / Min SMT7 mil / 7×10 mil
Surface treatmentENIG, Gold Finger, Immersion Silver/Tin, HASL(LF), OSP, ENEPIG, Flash Gold, Hard gold plating
Impedance toleranceSingle-ended ±5Ω (≤50Ω), ±7% (>50Ω); Differential ±5Ω (≤50Ω), ±7% (>50Ω)
Solder maskGreen, Black, Blue, Red, Matt Green
MaterialsITEQ Corp, Sytech, TUC, Panasonic, Rogers
Bow & twist0.30%
ParameterFlex capability
Max layer count8 layers
Inner layer min trace/space3/3 mil
Outer layer min trace/space3.5/4 mil
Inner / outer layer max copper2 oz / 2 oz
Min mechanical / laser drilling0.1 mm / 0.1 mm
Aspect ratio (mechanical drilling)10:1
Board thickness0.1 – 0.5 mm
Min / max board size5×10 mm / 9×14 in
Min BGA / Min SMT7 mil / 7×10 mil
Surface treatmentENIG, Gold Finger, Immersion Silver/Tin, HASL(LF), OSP, ENEPIG, Flash Gold, Hard gold plating
Impedance toleranceSingle-ended ±5Ω (≤50Ω), ±10% (>50Ω); Differential ±5Ω (≤50Ω), ±10% (>50Ω)
Solder maskGreen solder mask / Black PI / Yellow PI
MaterialsDuPont, Panasonic, ThinFlex, Sytech
ParameterRigid-flex capability
Max layer count36 layers
Inner layer min trace/space3/3 mil
Outer layer min trace/space3.5/4 mil
Inner / outer layer max copper6 oz / 3 oz
Min mechanical / laser drilling0.15 mm / 0.1 mm
Aspect ratio (mechanical drilling)12:1
Board thickness0.4 – 3 mm
Min / max board size10×10 mm / 22.5×30 in
Strain fillet width1.5 ± 0.5 mm
Surface treatmentENIG, Gold Finger, Immersion Silver/Tin, HASL(LF), OSP, ENEPIG, Flash Gold, Hard gold plating
Impedance toleranceSingle-ended ±5Ω (≤50Ω), ±10% (>50Ω); Differential ±5Ω (≤50Ω), ±10% (>50Ω)
Solder maskGreen, Black, Blue, Red, Matt Green
MaterialsDuPont, Panasonic, Taiflex, Sytech; Rigid: ITEQ, Sytech, TUC, Panasonic, Rogers
Bow & twist0.05%
— Reference sheets

Full capability
datasheets.

Click any sheet to view full resolution.

CircuitEDGE PCB overview
Overview & capabilities
Strategic applications
Strategic applications
PCB technical capabilities
Technical capabilities I
Surface treatment and materials
Technical capabilities II
SMT manufacturing specifications
SMT specifications
SMT core capabilities
SMT core capabilities
— SMT manufacturing

High-precision surface
mount assembly.

Full SMT/PTH assembly capabilities with BGA rework, wave soldering, and comprehensive inspection.

Single & double sided SMT/PTHYes
BGA & Micro BGA on both sidesYes
POP / FPOP manufacturingYes
Wave solderingYes
Smallest chip size1005
Min BGA / Micro BGA pitch0.008 in (0.2 mm)
Min leaded parts pitch0.008 in (0.2 mm)
Min IC pitch0.2 mm
Max parts size (machine assembly)2.2 × 2.2 × 0.6 in
Max PCB size14.5 × 19.5 in
Min PCB thickness0.1 mm
InspectionX-ray / Microscope 20×
PCB finishSMOBC, HASL, ENIG, Immersion Au/Ag/Tin, OSP
Panelized PCBTab routed / V-scored / Routed+V-scored
Odd-form partsLED, electrolytic caps, pots, sockets
Rework stationsBGA / SMT IR / Thru-hole
— CircuitEDGE by Synvert

Spec your board
with confidence.

Share your layer count, materials, finish, and assembly requirements — we'll respond with a fabrication plan.

Start an inquiry SPL Labs →